Samsung reportedly developing 24GB DDR5 memory ICs

Recently, Samsung Electronics reportedly announced that it is developing a single 24GB DDR5 memory chip to meet the needs of enterprise users such as cloud data centers. It can significantly increase the memory capacity for the server by using 32 memory sticks.

According to WCCFTech, the memory particles of Samsung 24GB DDR5 may be produced using an 8-Hi stacking process. At the moment, most of the latest server CPUs and workstation CPUs have 8 memory channels.

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Furthermore, it’s reported that if a single 768GB DDR5 memory is used and each channel uses two, then a total of 16 memories can achieve a memory capacity of up to 12TB. Recently, the company has also demonstrated a single 512GB RDIMM server memory module prototype that uses 32 pieces of 16GB particles.

It’s important to mention that Samsung’s 16GB memory particles can be mass-produced, but it will take some time for the 24GB memory particles to be successfully developed.

Moreover, the OEM has also revealed the progress of the EUV process and stated that its 14nm process is the most advanced process of its class. It’s expected that the company will use the EUV process in the second half of the year to manufacture 5 layers of stacked 16GB DDR5 DRAM memory. chip.