Samsung
Samsung concludes IT Academy 2020-21 session in Mobile Development, IoT, and Artificial Intelligence
In June-July, graduation projects were protected at project sites throughout Samsung Russia. By the end of the academic year, students have prepared each activity in one of these areas.
In the track “Mobile Development“, this is a mobile application in Java, in the “Internet of Things” track – a program that includes tools or a set of devices, and the track “Artificial Intelligence” – a solution to a neural network trained in a fixed database and built into the software system app.
According to training tracks, graduates are still distributed as follows – 46% successful on the track “Mobile Development”, 33% – on the “Internet of Things” track, and 21% – on the track “Artificial Intelligence”.
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It is very important that these courses are successfully integrated into the university curriculum – 30% of the respondents who participated in the “IT Academy” helped to secure the title of future bachelor’s degree.
Samsung IT Academy, a long-term education project for Samsung to develop the digital economy in Russia, provides an opportunity for university students to gain practical experience in areas of high demand for information technology.
At the end of the academic year, Samsung IT Academy graduates independently developed individual projects and, in the event of successful completion of the program, received a certificate from Samsung.
In addition, they participated in an annual merger project competition, the winners being determined by a panel of experts from Samsung and other leading companies in the IT industry. . This year the competition will be October 28-29.
This year, IT Academy for the first time hosted an open online conference for Samsung experts and invited speakers – 20 lectures on artificial intelligence and 15 lectures on the Internet of Things. He also presented an open video tutorial on Galaxy Upcycling – smartphone reuse.
In July, IT Academy and RTU MIREA signed an agreement to continue cooperation and agreed on training courses for the digital economy of the Russian Federation within the framework of the Samsung IT Academy project. And this year, a training course on the Internet of Things was launched in an attempt at a school in Lettovo (Moscow), and was successfully completed by three schoolchildren,
Samsung is working on a new heatsink technology to handle overheating in future Exynos chips. The company is reportedly developing HPB (heat path block) for mobile processors, reports TheElec. This technology is expected to help prevent abnormal platform overheating.
Future Exynos chips from Samsung could feature new heatsink technology. The Korean tech giant was allegedly working on a new chip package technology to prevent overheating. The package attaches a heat path block, or HPB, on top of the system on the chip.
Samsung’s new heatsink tech is called fan-out wafer-level package-HPB (FOWLP-HPB). The company’s Advanced Package (AVP) business, under its chip division, was in charge of development. The solution is aimed to be developed by the fourth quarter, followed by mass production.
The OEM is also developing a FOWLP-system-in-package (SIP). It could allow the company to mount multiple dies as a follow-up, which will launch in the fourth quarter of 2025. Both package types mount the HPB on top of the Mobile AP, with the memory chip placed next.
For the Galaxy S25 series, Samsung is considering replacing Exynos with MediaTek Dimensity. The poor yield rate is the biggest reason behind the company’s approach towards MediaTek. It would help from both aspects including price negotiations with Qualcomm and dual-chip strategy.
Therefore, the next year’s Exynos chip is expected to bring this new heatsink. If the SoC enters mass production, Samsung’s Galaxy S26 series might debut it in 2026. HPB, which is already used in server and PC chips was initially introduced for mobile chipsets.
The rising adoption of on-device AI has also increased concerns about mobile processor overheating. Currently, smartphones usually feature a vapor chamber cooling tech, which holds refrigerants to cool down the processor and other core components.
Samsung is rolling out a fresh update for its SmartThings app with version 1.8.17.22. The new update brings several improvements to enhance user experience and functionality.
The update brings the ability to share Routines with others. Now, users can easily collaborate by sharing their customized routines with family or friends.
In addition, the device tab experience has been significantly improved for a seamless user experience. Users can expect a more intuitive interface for managing and interacting with their connected devices.
Furthermore, the update introduces support for hub group management menus for better flexibility and control over the hub within the SmartThings.
Samsung SmartThings 1.8.17.22 update is available on the Galaxy Store with a package size of 110MB. To install the update, you just need to visit the Galaxy Store app >> Menu option >> Updates. Also, you can directly download the update through the One UI build version mentioned here.
Samsung will launch its new foldable smartphones next week. Ahead of the event, official promotional images of the Galaxy Z Flip 6 have been leaked. The material shows off the upcoming Flip phone in all its glory as well as some parts of the user interface.
Famous leakster EvanBlass published official promotional images of the Galaxy Z Flip 6. The phone is shown in its Light Blue colorway, which is accompanied by black on the cover. The camera ring looks quite hot, matching the shades of the phone’s frame color.
The phone will continue to feature a folder icon-styled cover screen. Thanks to its enhanced droplet-hinge tech, the phone folds flat – leaving no gap between the panels. It would also get software-derived enhancements for even better cover screen usability.
The Galaxy Z Flip 6 is expected to bring a new cover display with increased refresh rate and brightness. It will offer an enhanced user experience to owners, with a higher refresh rate offering smoother operations. Also, the brighter cover panel will ensure seamless activities even in sunlight.
The South Korean tech giant confirmed to hold Galaxy Unpacked on July 10 in Paris. At the event, the new foldable phones will be introduced alongside the Galaxy Watch Ultra, Galaxy Ring, Galaxy Buds 3 series, and Galaxy Watch 7 series.
The Galaxy Z Flip 6 will be powered by Qualcomm’s Snapdragon 8 Gen 3 processor. In terms of software, the device will run One UI 6.1.1 version with new Galaxy AI features. The sad news is that the next Flip phone could be pricier than its predecessor in some markets.