Samsung to start 3nm chip production next week

South Korean media outlet Yonhap reported that Samsung is likely to announce the mass production of its next-gen 3nm chipset next week. If it becomes reality, the company will beat its biggest rival TSMC in using the advanced chip manufacturing process.

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According to the information, the next-generation 3nm chips will be manufactured on the Gate-All-Around (GAA) technology. Samsung earlier said that the new process reduces 45 percent area alongside providing 30 percent higher performance and 50 percent lower power consumption, as compared to existing FinFET process.

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Last month, Samsung showcased its 3nm chips to the United States’ President Joe Biden during his visit to the world’s largest semiconductor facility in Samsung’s Pyeongtaek complex in Seoul. Meanwhile, TSMC is reportedly planning to start mass production of 3nm chips in the second half.

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Samsung and TSMC are competing to become the world’s first 3nm chipset developer on the commercial channels as part of winning orders from smartphone vendors. However, it will be interesting to see which company delivers mobile chipsets with higher efficiency and performance.

Aside from this, the Korean tech giant earlier disclosed that its 2nm process node was in the early stages of development, while the mass production planned for 2025. Well, the 3nm chip phones are likely to start launching later this year, while Samsung will bring it with the Galaxy S23 series in early next year.

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