Samsung is developing new automotive chip packaging technology

Samsung is reportedly working to develop a new automotive chip packaging technology with its key partners. The company is developing an aluminum oxide (Al2O3) coating bonding wire technology that will save costs without compromising with reliability and insulation.

The South Korean tech giant’s aluminum alternative, which is under development with Electron, NCD and LT Metal, doesn’t have a problem of explosion with mixed materials. The aluminum oxide is coated at nanometer thinness onto the metal used as wire.

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New Samsung automotive chip packaging technology

Compared to silver and copper, aluminum oxide bonds well with insulating coating materials that use epoxy. Besides, the company is also planning to use atomic layer deposition to deposit the aluminum oxide as is testing various thicknesses.

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In Chipsets, bonding wires connect the I/Os with the lead frame or printed circuit boards. In the past, most of them were made of gold (Au) as it brings flexibility and conductivity. Meanwhile, the prices of gold are increasing day by day, hence, OEMs are considering to mix them with silver (Ag) or copper (Cu).

Mixed materials are reported to have weak adhesiveness with their coating materials due to which, automobile manufacturers won’t accept such chipsets as there are chances of explosion in high-temperature and high-humidity environments.