Samsung ushers Advanced 3D Package tech that’s rocking the world

In the past, semiconductor firms including Samsung have developed products focusing on how much smaller and more transistors can be integrated into a chip of the same size. Earlier, “Gordon Moore” predicted that ‘the density of semiconductors doubles every 24 months’, and this is the well-known “Moore’s Law.”

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‘Moore’s Law’ has changed little by little following the speed of semiconductor technology development, but has been followed for more than 50 years. As the era of smartphones, mobile Internet, AI, and Big Data has arrived, the required computing power is rapidly increasing.

Since the pace of progress and innovation in semiconductor technology has slowed, the miniaturization of semiconductor processes has reached its physical limit, so the rate of increase in integration has slowed. In other words, ‘Moore’s Law’ is approaching its limit.

Samsung’s “Beyond Moore” approach

Industry wants a versatile semiconductor that integrates various functions into one. As the process is miniaturized, there is a problem that analog performance deteriorates, and it is true that it is difficult to efficiently respond to these demands only with process miniaturization based on Moore’s Law.

Through advanced Heterogeneous Integration technology that connects multiple semiconductors horizontally and vertically, it is possible to integrate more transistors in a smaller semiconductor package, and a more powerful performance that surpasses the performance of each. can provide.

Research institutes show that the high-tech package market is expected to record high growth at a CAGR of 9.6% from 2021 to 2027. Particularly, 2.5D and 3D packages using heterogeneous integration technology are expected to grow by more than 14% annually.

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