News
Samsung shakes up its semiconductor business structure
Samsung Electronics executed a major restructuring of its semiconductor business (DS Division), including personnel management. The company will first make a change in personnel at the DRAM Development Office in its Memory Business Group.
Hwang Sang-jun, a vice president who worked in the Memory Strategic Marketing Office, has been tapped as the new head of the DRAM Development Office. The Korean tech giant has set up the A-FAB TF under the Manufacturing Synergy Team and the Material Technology Team under the Manufacturing Group.
Follow our socials → Google News, Telegram, Twitter, Facebook
The Memory Manufacturing Technology Center (MTC), relocated from Hwaseong to Pyeongtaek, will be integrated with the Foundry MTC. The Memory E/F Team at the Memory MTC has been renamed the Back End of Line (BEOL) FAB Team.
The Research Line Operation Team in charge of global manufacturing & infrastructure has been transferred to the manufacturing sector.
The Energy Solutions TU has been created at the Samsung Advanced Institute of Technology (SAIT), which serves as Samsung’s brain center for expanding the application of AI under Kyung Kye-hyun, president and CEO of Samsung Electronics’ DS Division.
The foundry chief technology officer (CTO) was replaced by Yoon Jong-shik, vice president of the Foundry Technology Development Office. The vacant CTO position was filled by Koo Ja-heum, vice president of foundry technology development.
This much organizational change in the midst of an irregular personnel season after 2022 is considered quite unusual. The reorganization reflects Samsung’s strong desire to proactively respond to future market changes, as demand for semiconductors is expected to recover in the second half.