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TSMC confirms 3nm smartphone and HPC chips coming this year
During its recent earnings call, TSMC revealed that 3nm chips for smartphones and HPCs coming this year. It’s worth mentioning that the Taiwanese chip manufacturer started mass production of chips on its N3 (3nm-class) process technology late last year.
The company also confirmed its N3E node is on track for high-volume manufacturing later this year. It’s the first time when TSMC officially commented on applications that use its initial N3 fabrication process. For customer privacy reasons, TSMC does not disclose which customers are using N3.
Apple is expected to be the initial consumer of TSMC’s 3nm process chipsets, followed by Qualcomm.
“We are seeing robust demand for N3 and we expect a strong ramp of N3 in the second half of this year, supported by both HPC and smartphone applications,” said C.C. Wei, chief executive officer of TSMC, during the company’s earnings. Call with financial analysts and investors.
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Via – AnandTech
Source – TSMC