Samsung Empowers AMD with High-Bandwidth Memory and Advanced Packaging for AI Accelerators

Samsung is empowering AMD with its cutting-edge HBM (high-bandwidth memory) and advanced packaging for AI accelerators. Korean media Hankyung reports that Samsung is providing high-bandwidth memory and advanced packaging service to AMD.

In the beginning, AMD promoted a plan to package HBM, which was delivered from Samsung Elec., with GPUs through Taiwan’s TSMC. However, when TSMC’s supply of advanced packaging could not meet demand, it sought an alternative.

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At present, Samsung is the only company that can provide high-tech packaging service with HBM. Samsung Electronics plans to bundle HBM and advanced packaging required for AMD’s MI300X and provide them as a ‘turnkey service’.

It’s predicted that the Korean tech giant’s HBM market share will exceed 50% next year. Per the industry insiders, Samsung recently passed the final quality test of the 4th generation HBM ‘HBM3’ and advanced packaging from AMD.