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Samsung launches 12nm-class 32GB DDR5 DRAM: Ideal for AI era
Samsung has officially confirmed that it has developed the world’s first and highest-capacity 32GB DDR5 DRAM using 12nm process technology. Back in May, the company began the mass production of its 12nm 16GB DDR5 DRAM.
With its 12nm-class 32Gb DDR5 DRAM as a foundation, Samsung plans to continue expanding its lineup of high-capacity DRAM to meet the current and future demands of the computing and IT industry. Mass production of the new 12nm-class 32Gb DDR5 DRAM is scheduled to begin by the end of this year.
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Having developed its first 64Kb DRAM in 1983, Samsung has now succeeded in enhancing its DRAM capacity by a factor of 500,000 over the last 40 years. The new DDR5 DRAM was developed using cutting-edge processes and technologies to offer double the capacity of 16Gb DDR5 in the same package size.
Samsung will reaffirm its leadership in the next-gen DRAM market by supplying the 12-nm-class 32Gb DRAM to data centers as well as to customers that require applications like AI. The product will also play an important role in Samsung’s continued collaboration with other key industry players.
“With our 12nm-class 32Gb DRAM, we have secured a solution that will enable DRAM modules of up to 1 terabyte (TB), allowing us to be ideally positioned to serve the growing need for high-capacity DRAM in the era of AI (Artificial Intelligence) and big data,” said SangJoon Hwang, Executive VP of DRAM Product & Technology at Samsung Electronics.
