Mystery US company tapped Samsung to fabricate 3nm server chipsets

Samsung is expected to produce 3nm server chipsets for a mystery US customer. A new report from AD Technology calls for the development of a 2.5D server part, which leverages Samsung’s gate-all-around (GAA) transistor design, introduced with its 3nm process tech last year.

The contract win is significant for Samsung as much of the datacenter silicon that makes use of advanced packaging is fabbed by TSMC. That’s not to say Samsung hasn’t had success in the arena; Baidu and Samsung worked on an HBM-equipped AI accelerator for the datacenter a few years back, reports TheRegister.

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AD Technology specializes in the design and implementation of silicon interposers. They’re often used to connect compute dies, like GPUs, with high-bandwidth memory over the shortest distance possible. The silicon may be used in an AI accelerator or some other bandwidth-constrained application.

AD Technology announcement reads:

AD Technology, Korea’s No. 1 semiconductor design house, announced today that it has completed a contract with an overseas customer for a 2.5D server-oriented semiconductor design project based on a 3-nanometer process using GAA (Gate-All-Around), a next-generation transistor structure.