Samsung
Samsung drilling next-gen semiconductor immersion cooling tech
Immersion cooling is a next-gen semiconductor cooling tech that cools electronics hardware by directly immersing it in non-conductive cooling oil. DS Division’s Hwang Yu-cheol revealed that Samsung preparing memory devices for immersion cooling.
While Android phones will continue to ship 4nm chips another year, Apple introduced its 3nm chipset with the iPhone 15 Pro lineup. As semiconductor miniaturization reaches its physical limits, interest in packaging technology to increase chip performance is growing.
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Heat management, which lets semiconductors perform at high performance is becoming an important issue. Chip heat management that increases cooling efficiency to reduce power consumption also appears to be entering the area of post-processing.
The proposed Samsung immersion cooling tech can significantly reduce cooling power compared to the existing air cooling method and reduce energy consumption. Although the initial cost of building infrastructure is high, it is highly stable and semi-permanent, so there are advantages in many terms.
