Intel takes in a chip expert who even Samsung couldn’t recruit

Intel has recently announced (internally) that Dr. Chunheung Lee will take charge of Assembly Test Technology Development, starting in December. It’s worth noting that Samsung also sought to recruit Dr. Lee, but it didn’t and the reason was his age.

On the surface, the reason is age, but it is said that Samsung Semiconductor’s organizational culture at the time and internal opposition were also significant. The company, therefore, established a new Advanced Packaging (AVP) business team last year.

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Intel has recently been actively announcing that it plans to apply cutting-edge package technologies such as 2.5D and 3D to its own products or foundry services. The company is consolidating its capabilities by making large-scale investments in related fields.

Dr. Chunheung Lee

Before working at JCET, Dr. Lee served as CTO and Vice President of Overseas Manufacturing at Amkor Technology and President of Amkor Korea. He holds 38 package-related patents in Korea and 21 in the United States under his name.

Industry experts positively evaluate Dr. Lee’s success in meeting the cutting-edge package technology needs of global semiconductor companies such as Apple and Qualcomm while serving as Global CTO of Stats Chippack Korea. He also led technological collaboration with Taiwan’s TSMC.