Samsung develops 2.3D semiconductor packaging technology for AI chips

Samsung develops the next-gen (2.3D) semiconductor packaging technology as part of competing with its rivals – Intel and TSMC. Samsung’s 2.3D packaging technology is used to manufacture high-performance semiconductors such as AI (artificial intelligence) chips.

The Samsung 2.3D semiconductor packaging technology has reached a level of completeness that allows for mass production with customers. Moreover, the company is assessed to have established an important foothold in the AI ​​semiconductor industry led by Intel and TSMC.

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Samsung replaced the silicon interposer with a ‘silicon bridge’. This is a method (bridge) that adds silicon only to necessary areas instead of the entire semiconductor area. Specifically, a silicon bridge is inserted (embedded·E) into the redistribution layer (RDL), which is essential for packaging.

“We have developed it and are preparing for mass production with major customers. Several major companies are showing interest. We plan to have mass production infrastructure in place by next year.” – Kim Gu-young, head of the process development team at Samsung Electronics AVP.

Based on a semiconductor chip package equipped with 12 HBMs, costs can be reduced by 22% without performance degradation compared to using a silicon interposer. In the semiconductor industry, the method using bridges is called “2.3D packaging.”

// ETNews