Samsung FOWLP process begins mass production for Exynos 2400

Samsung launched the cutting-edge FOWLP (Fan-out Wafer Level Packaging) technology into its mass production line. The company has recently completed verification of FOWLP technology and began mass production, most probably for Exynos 2400.

With the mass production and delivery of FOWLP as originally scheduled, Samsung has thrown a full-fledged pursuit of TSMC in the high-tech packaging market. The company has been focusing on technology development starting this year to mass-produce FOWLP.

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Fan-out Wafer Level Packaging is considered an important packaging technology to improve the limits of semiconductor integration. The Korean tech giant plans to capture the packaging market dominated by TSMC through mass production of FOWLP.

Samsung first unveiled GDDR6W using FOWLP technology at the end of last year. Previously, FOWLP mass production was announced in the fourth quarter of this year and announced that it would be applied to Samsung’s premium system semiconductor – Exynos 2400.

// Edaily