Samsung confirms advanced semiconductor R&D center in Japan

Samsung is set to construct an R&D center in Japan to research advanced semiconductor packaging, materials, parts, and equipment. The company will invest 40 billion yen to establish a new semiconductor R&D base in the Minato Mirai district of Yokohama, Japan.

According to the report, Samsung plans to hire about 100 people at its new R&D center in Japan to promote the development of semiconductor packaging and electronics technology. Not only local Japanese personnel but also South Korean R&D personnel will be hired.

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The Japanese government is coordinating a plan to subsidize 20 billion yen, which is about half of the investment amount. Meanwhile, the exact subsidy amount will be finalized at a meeting on investment expansion at the Prime Minister’s Office chaired by Japanese PM Fumio Kishida.

// ETNews