Following Samsung, SK Hynix develops ‘reusable CMP pad’

Following Samsung, SK Hynix has developed reusable CMP pad technology to flatten semiconductor wafers. Korean media reports that SK Hynix succeeded in developing chemical mechanical polishing (CMP) pad reuse technology.

SK Hynix bypassed Samsung Electronics and F&S Tech’s patents and researched its own CMP pad reuse technology. This is a method to reconstruct the worn pad surface pattern after the CMP process.

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Wafer polishing pads are essential in the semiconductor process, but they are highly dependent on foreign products and have a large amount of waste, leading to significant cost and environmental problems.

The reusable CMP pad was developed under the leadership of C&C, the manufacturing technology department of SK Hynix. It was decided to apply it sequentially starting next year, starting with processes with low difficulty and risk.

SK Hynix claims that over half of the CMP process consumables are CMP pads. Consumption is significant, exceeding 10,000 pieces per month, but so far, many have been imported from overseas and discarded after use.

// Source