Phones
Samsung plans to use FOWLP for Exynos processor used in Galaxy S25 Series
It’s been just a month since Samsung unveiled the Galaxy S24 series, and rumors about the Galaxy S25 lineup have already begun to hover on the web. A recent info, suggests that Samsung is planning to use FOWLP for Exynos processor used in the Galaxy S25 Series.
Samsung Electronics will apply FOWLP (fan-out wafer level packaging) to the Exynos 2500 (tentative name) processor that will be included in the Galaxy S25 series. Simultaneously, the lineup will be released in the first half of next year.
The flagship Galaxy S lineup usually includes three models among which the Ultra comes exclusively with a Snapdragon processor. While, the standard and plus uses Snapdragon and Exynos chips depending on the region. Therefore, the case is going to be the same with the S25 series.
FOWLP is a next-generation packaging technology that does not use a printed circuit board (PCB) by mounting semiconductors directly on a wafer. It widens the packaging area while reducing the packaging thickness resulting in heat increases and improved heat dissipation performance.
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It’s also worth mentioning that, FOWLP was also applied to Exynos 2400, which was introduced in the Galaxy S24 series and it will continue to applied on premium phones. While, currently there is no possibility that the Korean tech giant will apply FOWLP to Exynos for affordable phones like Galaxy A series.
