Samsung
Samsung plans to use SK Hynix MUF tech alongside NCF in latest HBM chips
Demand for HBM is rapidly increasing due to the recent generative AI craze, accordingly, the HBM market is divided between Samsung and SK Hynix. So to keep up with the competition, Samsung is planning to use SK Hynix MUF alongside its own NCF tech in the production of the latest HBM chips.
As per the Reuters report, Samsung will adopt the technology of its competitor SK Hynix to increase the yield of high bandwidth memory (HBM). As Samsung Electronics recently purchased semiconductor manufacturing equipment that can apply MUF tech and this has to do something with HBM yield.
To be mentioned, Samsung usually uses NCF technology in HBM packaging, which connects chips by inserting a film between them. On the other hand, SK Hynix uses MR-MUF technology, which fills and attaches special materials to the spaces between chips.
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Moving on, Samsung HBM3 yield is 10-20%, while SK Hynix’s is known to be 60-70%. Therefore, the South Korean tech giant might be planning to use both NCF and MUF technologies in its latest HBM chips. Simultaneously, the firm is also having discussions with materials companies such as Japan’s Nagase.
Samsung Electronics said,
- “We have no plans to introduce the MUF process to HBM.” The semiconductor industry predicts that MUF equipment may be used in other semiconductor processes besides HBM.
