TSMC unveils A16: 1.6nm semiconductor manufacturing process

TSMC will commence 1.6nm semiconductor production in the second half of 2026. The company’s Co-Chief Operating Officer, Y.J. Mii, announced (via NikkeiAsia) in the US that the new A16 chip manufacturing technology will begin production in the second half of 2026.

South Korea’s Samsung Electronics is also working on 1.6nm process tech, called Backside Power Delivery. Taiwanese chipmaker said that 1.6nm is an area where they are competing with Intel, racing to boost the speed of AI semiconductors.

Demand from AI chip companies led TSMC to develop the new A16 chip manufacturing process faster than expected. High NA EUV, the next-generation extreme ultraviolet exposure equipment for drawing ultra-fine circuits, is unlikely to be used.

Samsung previously revealed it plans to mass produce 2nm in 2025 and 1.4nm in 2027, which is similar to TSMC. Meanwhile, Intel could start mass production of the 1.8nm process later this year, with 1.4nm expected to be announced in 2027.

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