Samsung
Samsung and Synopsys team up for 3nm AI mobile chip
Samsung and Synopsys announced their collaboration for 3nm AI-powered mobile chip. Both companies announced they had accomplished the production tapeout for a Samsung high-performance mobile SoC design.
According to AnandTech, future Samsung mobile SoCs could get flagship CPU and GPU, with 300MHz higher performance using Synopsys.ai full stack AI-driven EDA suite.
The report also hints a broad portfolio of Synopsys IP on Samsung Foundry’s latest 3nm Gate-All-Around (GAA) process technologies will further empower the company’s mobile AI processor portfolio.
The combination of Synopsys.ai EDA suite, Synopsys Fusion Compiler RTL-to-GDSII solution for PPA, and Synopsys DSO.ai was critical to achieving these goals, reports embeddedcomputing.
“Our longstanding collaboration has delivered leading-edge SoC designs. This is a remarkable milestone to successfully achieve the highest performance, power and area on the most advanced mobile CPU cores and SoC designs in collaboration with Synopsys,” said Kijoon Hong, vice president of SLSI at Samsung Electronics.
“Not only have we demonstrated that AI-driven solutions can help us achieve PPA targets for even the most advanced GAA process technologies, but through our partnership we have established an ultra-high-productivity design system that is consistently delivering impressive results,” Kijoon Hong added.
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