Samsung tasked force to finalize HBM deal with Nvidia

Samsung formed a team for a billions-of-dollars HBM supply deal with Nvidia. The company is putting efforts into winning the contract from the global artificial intelligence semiconductor giant to beat the HBM market leader SK Hynix.

According to KEDGlobal, Samsung made a task force to finalize its HBM deal with Nvidia. The team comprises about 100 excellent engineers, who have been working to improve manufacturing yields and quality with the first aim to pass Nvidia’s tests.

“Samsung aims to log a high market share by quickly increasing supply to Nvidia,” said one of the sources. “It is expected to speed up the supply from the third quarter.”

Previously, Nvidia CEO Jensen Huang asked Samsung Elec to increase the yields and quality of 8-layer and 12-layer HBM3E chips for supply. It’s worth noting that HBM3E is the world’s best-performing DRAM chip for AI applications.

36Gb 12-layer HBM

The South Korean tech giant has been focussing on the 36Gb 12-layer HBM3E model. Samsung finished the development of HBM3E in February 2024 and aiming to pass the quality test conducted by Nvidia this month.

To meet Nvidia’s demand, the company has secured production lines already to increase output. The 12-layer HBM3E improves AI learning speed by 34% on average compared to the 8-layer product.

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