AMD launches 3nm silicon masking Samsung process

AMD launched a new 3nm data center CPU, keeping the Samsung Foundry process unconfirmed. While the company officially debuted its new 3nm semiconductor, it avoided confirming whether it’s fabricated on Samsung’s 3nm GAA process.

Lisa Su, the CEO of AMD, introduced a 3nm EPYC 9005 CPU developed for data centers. Previously, it was reported that AMD planning to utilize Samsung Foundry’s 3nm GAA process. However, the fabrication process remains to be confirmed by the manufacturer.

Announced at Computex 2024, AMD’s 3nm CPU is slated for release in the second half. AMD also announced that the new silicon offers up to 5.4 times better performance than Intel Xeon in major artificial intelligence (AI) workloads.

Reportedly, during AMD CEO Lisa Su’s appearance at the 2024 ITF World, which was hosted by the Belgian microelectronics research center IMEC, Su revealed that AMD plans to use the 3nm GAA process for mass-producing next-generation chips.

As the South Korean tech giant is currently the only chip manufacturer with commercialized 3nm GAA process technology, Su’s comments were interpreted as indicating that AMD will officially collaborate with Samsung for 3nm production.