Samsung unveiled 16-layer HBM with Hybrid bonding

Samsung highlighted that Hybrid bonding technology is essential for an HBM of 16-layer or more layers. A report reveals that the company revealed a paper titled “Research on D2W hybrid copper (Cu) bonding technology for HBM lamination” last month.

The Korean tech giant presented this paper at the US’s 74th Electronic Component Technology Conference. Samsung has reportedly highlighted that the hybrid bonding technology is essential for mass production of 16-layer or HBM with more layers.

Samsung may develop samples of HBM4 products, which will mainly be 16-layer products, in 2025 and begin mass production in 2026.  This is a roadmap that runs counter to SK Hynix’s plan to apply Advanced Mass Reflow-Molded Underfill (MR-MUF) up to 16 layers.

Last but not least, Samsung also revealed the HBM manufacturing method through hybrid bonding. The company developed a 16-layer HBM3 sample using SEMES hybrid bonding equipment last April and announced that it worked normally.