Samsung explores new ‘heatsink’ to handle Exynos overheating

Samsung is working on a new heatsink technology to handle overheating in future Exynos chips. The company is reportedly developing HPB (heat path block) for mobile processors, reports TheElec. This technology is expected to help prevent abnormal platform overheating.

Future Exynos chips from Samsung could feature new heatsink technology. The Korean tech giant was allegedly working on a new chip package technology to prevent overheating. The package attaches a heat path block, or HPB, on top of the system on the chip.

Samsung’s new heatsink tech is called fan-out wafer-level package-HPB (FOWLP-HPB). The company’s Advanced Package (AVP) business, under its chip division, was in charge of development. The solution is aimed to be developed by the fourth quarter, followed by mass production.

The OEM is also developing a FOWLP-system-in-package (SIP). It could allow the company to mount multiple dies as a follow-up, which will launch in the fourth quarter of 2025. Both package types mount the HPB on top of the Mobile AP, with the memory chip placed next.

For the Galaxy S25 series, Samsung is considering replacing Exynos with MediaTek Dimensity. The poor yield rate is the biggest reason behind the company’s approach towards MediaTek. It would help from both aspects including price negotiations with Qualcomm and dual-chip strategy.

Therefore, the next year’s Exynos chip is expected to bring this new heatsink. If the SoC enters mass production, Samsung’s Galaxy S26 series might debut it in 2026. HPB, which is already used in server and PC chips was initially introduced for mobile chipsets.

The rising adoption of on-device AI has also increased concerns about mobile processor overheating. Currently, smartphones usually feature a vapor chamber cooling tech, which holds refrigerants to cool down the processor and other core components.