Samsung LPDDR5X DRAM will power the future of Mobile AI

Samsung begins mass production of LPDDR5X DRAM aiming for future Mobile AI. The company officially announced that it has started mass production of the world’s thinnest 12nm-class 12GB and 16GB LPDDR5X DRAM packages.

By optimizing PCB and epoxy molding compound techniques, the new Samsung LPDDR DRAM package is as thin as a fingernail at 0.65mm. Samsung’s optimized back-lapping process is also used to minimize the package height.

Thanks to its extensive expertise in chip packaging, Samsung is capable of delivering ultra-slim LPDDR5X DRAM packages. It can create additional space within mobile devices, facilitating better airflow, and potentially improving on-device AI tasks.

With the new LPDDR5X DRAM, Samsung offers the industry’s thinnest 12nm-class LPDDR DRAM in a 4-stack structure, reducing the thickness by approximately 9% and improving heat resistance by about 21.2% over the previous generation.

This supports easier thermal control, a factor that is becoming increasingly critical, especially for high-performance applications with advanced features such as on-device AI. Meanwhile, Samsung hasn’t confirmed which devices will ultimately use the new DRAM.

“Samsung’s LPDDR5X DRAM sets a new standard for high-performance on-device AI solutions, offering not only superior LPDDR performance but also advanced thermal management in an ultra-compact package,” said YongCheol Bae, Executive Vice President of Memory Product Planning at Samsung Electronics.

Earlier, the Korean tech giant unveiled the next generation of DRAM technology. We guess the Galaxy S25 series could use Samsung’s new LPDDR5X DRAM. It is slated to bring significant improvement to on-device AI capabilities.