Samsung’s semiconductor automation to boost productivity, reduce costs

Samsung is ambitious to automate its semiconductor packaging by 2034. In semiconductor production, packaging has become a critical process. It includes the operation of cutting and connecting the wiring of semiconductor wafers.

The South Korean tech giant is leading the world (via ETNews) with an automation rate of around 80% for its back-end package fab. Although there are various challenges, the company will achieve 100% automated packaging within 10 years.

Samsung official reveals the front-end factory uses only one type of wafer as raw material. However, the back-end package factory uses 68 different types, making it difficult to completely automate the packaging process.

Not that all but the number of transportation containers is 5x (16 types) and the number of logistics devices is 16x (49 types) more than the front-end process. The company has been working since 2010 to automate this complex packaging process.

The task force that came into effect 14 years back has also shown positive outcomes. Samsung achieved a 99% automation in logistics and raised the automation rates of equipment to 50%, manufacturing operation software to 90%, and quality automation to 70%.