Samsung boosts HBM capabilities with new investments

Samsung has reportedly signed a contract valued at around $15 million to sell and purchase semiconductor equipment to expand HBM chip production facilities at its Suzhou plant in China.

BusinessKorea reports that Samsung is expanding its investments across HBM facilities. The company aims to strengthen its advanced semiconductor packaging to lead the supply chain.

Eying the HBM4 chip boom, the Korean tech giant is focusing on enhancing its packaging capabilities to secure future technological competitiveness and narrow the gap with SK Hynix.

KEDGlobal revealed that Tesla asked Samsung and SK Hynix to supply HBM4 samples. The US EV maker could choose either Samsung or SK Hynix as its HBM4 supplier after testing samples.

Pay attention, packaging includes the tech and processes for shaping semiconductor chips to fit the devices they will be mounted on – making it an important aspect of development and production.

Notably, the Suzhou China facility is currently Samsung’s test and packaging production base outside Korea. Increased investment is seen as a choice for innovation in packaging processes and production efficiency.

Apart from this, the company is also ramping up its packaging production bases in Korea. Samsung has recently signed an investment agreement with South Chungcheong Province and Cheonan City.