Samsung
Samsung Galaxy S24 shines on Ferris wheel in Rio de Janeiro
Samsung’s new Galaxy S24 lineup will receive animated projections on a Ferris wheel in Rio de Janeiro until the end of February. The action, which can be seen from the skies by passengers traveling by air between São Paulo and Rio de Janeiro, takes place daily, from 6pm to 5am, until February 18.
The new Galaxy S24, Galaxy S24+ and Galaxy S24 Ultra are the first smartphones to feature Galaxy AI, which helps with daily tasks, such as summarizing and organizing notes and translating voice calls and text messages into other languages.
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This is without the need for third-party applications, as all processing takes place on the smartphone itself. AI is also present in the image capture and editing of the new Galaxy S24, thanks to the improved Nightography and the Edit Suggestion and Generative Editing tools.
Passengers en route from São Paulo to Rio de Janeiro, landing at Santos Dumont Airport, will be able to see animations projected on a Ferris wheel that show the slogan “Galaxy S24 with Galaxy AI. Epic, just like as that.” Passengers on the right side of the aircraft will have a privileged view of the action.
The action aimed to reinforce the new Artificial Intelligence features of the Galaxy S24 line, which breaks down communication barriers with intelligent translations of text and calls, setting a new standard of mobile technology for Galaxy device owners.
Samsung is working on a new heatsink technology to handle overheating in future Exynos chips. The company is reportedly developing HPB (heat path block) for mobile processors, reports TheElec. This technology is expected to help prevent abnormal platform overheating.
Future Exynos chips from Samsung could feature new heatsink technology. The Korean tech giant was allegedly working on a new chip package technology to prevent overheating. The package attaches a heat path block, or HPB, on top of the system on the chip.
Samsung’s new heatsink tech is called fan-out wafer-level package-HPB (FOWLP-HPB). The company’s Advanced Package (AVP) business, under its chip division, was in charge of development. The solution is aimed to be developed by the fourth quarter, followed by mass production.
The OEM is also developing a FOWLP-system-in-package (SIP). It could allow the company to mount multiple dies as a follow-up, which will launch in the fourth quarter of 2025. Both package types mount the HPB on top of the Mobile AP, with the memory chip placed next.
For the Galaxy S25 series, Samsung is considering replacing Exynos with MediaTek Dimensity. The poor yield rate is the biggest reason behind the company’s approach towards MediaTek. It would help from both aspects including price negotiations with Qualcomm and dual-chip strategy.
Therefore, the next year’s Exynos chip is expected to bring this new heatsink. If the SoC enters mass production, Samsung’s Galaxy S26 series might debut it in 2026. HPB, which is already used in server and PC chips was initially introduced for mobile chipsets.
The rising adoption of on-device AI has also increased concerns about mobile processor overheating. Currently, smartphones usually feature a vapor chamber cooling tech, which holds refrigerants to cool down the processor and other core components.
Samsung is rolling out a fresh update for its SmartThings app with version 1.8.17.22. The new update brings several improvements to enhance user experience and functionality.
The update brings the ability to share Routines with others. Now, users can easily collaborate by sharing their customized routines with family or friends.
In addition, the device tab experience has been significantly improved for a seamless user experience. Users can expect a more intuitive interface for managing and interacting with their connected devices.
Furthermore, the update introduces support for hub group management menus for better flexibility and control over the hub within the SmartThings.
Samsung SmartThings 1.8.17.22 update is available on the Galaxy Store with a package size of 110MB. To install the update, you just need to visit the Galaxy Store app >> Menu option >> Updates. Also, you can directly download the update through the One UI build version mentioned here.
Samsung will launch its new foldable smartphones next week. Ahead of the event, official promotional images of the Galaxy Z Flip 6 have been leaked. The material shows off the upcoming Flip phone in all its glory as well as some parts of the user interface.
Famous leakster EvanBlass published official promotional images of the Galaxy Z Flip 6. The phone is shown in its Light Blue colorway, which is accompanied by black on the cover. The camera ring looks quite hot, matching the shades of the phone’s frame color.
The phone will continue to feature a folder icon-styled cover screen. Thanks to its enhanced droplet-hinge tech, the phone folds flat – leaving no gap between the panels. It would also get software-derived enhancements for even better cover screen usability.
The Galaxy Z Flip 6 is expected to bring a new cover display with increased refresh rate and brightness. It will offer an enhanced user experience to owners, with a higher refresh rate offering smoother operations. Also, the brighter cover panel will ensure seamless activities even in sunlight.
The South Korean tech giant confirmed to hold Galaxy Unpacked on July 10 in Paris. At the event, the new foldable phones will be introduced alongside the Galaxy Watch Ultra, Galaxy Ring, Galaxy Buds 3 series, and Galaxy Watch 7 series.
The Galaxy Z Flip 6 will be powered by Qualcomm’s Snapdragon 8 Gen 3 processor. In terms of software, the device will run One UI 6.1.1 version with new Galaxy AI features. The sad news is that the next Flip phone could be pricier than its predecessor in some markets.