Samsung is set to construct an R&D center in Japan to research advanced semiconductor packaging, materials, parts, and equipment. The company will invest 40 billion yen to...
Samsung plans to invest $21 billion in wafer manufacturing equipment (WFE) in 2024. This is an increase of more than 25% compared to its $16.8 billion...
Prosecutors have formally requested arrest warrants for two former Samsung officials, alleging their involvement in leaking Korea’s semiconductor technology to China. On Wednesday, the Information Technology...
On December 12, Samsung and Dutch tech giant ASML signed a deal worth around $755 million to build a semiconductor research plant in South Korea. In...
Samsung aiming for a rebound by investing in large-scale semiconductor equipment. A new report claims that Samsung will additionally import EUV (extreme ultraviolet) semiconductor exposure equipment...
Samsung and SK Hynix are focusing on the preemptive development of memory to support the advancement of AI. It’s likely to lead to the creation of...
Samsung Electronics breaks SK Hynix’s high-bandwidth memory HBM3 exclusive structure for NVIDIA. The company’s sluggish semiconductor business performance is expected to quickly recover next year. According...
Samsung develops the next-gen (2.3D) semiconductor packaging technology as part of competing with its rivals – Intel and TSMC. Samsung’s 2.3D packaging technology is used to...
Immersion cooling is a next-gen semiconductor cooling tech that cools electronics hardware by directly immersing it in non-conductive cooling oil. DS Division’s Hwang Yu-cheol revealed that...
At Semiconductor Expo 2023, the Chief Technology Officer of Samsung Foundry Division revealed that big customers are in touch for 2nm and 1.4nm semiconductors. If everything...